М. Е. Сарычев

Часть публикаций из профиля, по году от новых к старым. Это не полный список последних работ автора; работы без года — в конце.

• Kinetics of electromigration mass transfer in micro- and nanoelectronics interface elements depending on the strength of thin-film junctions2024
• Kinetics of Electromigration Mass Transfer in the Interface Elements of Micro- and Nanoelectronics Depending on the Strength of Thin-Film Connections2024
• Simulation of the Effect of Lattice Defects on the Work of Joined Materials Separation2023
• Simulation of the Effect of Lattice Defects on the Work of Separating Joined Materials2023
• Effect of Lattice Defects on the Electromigration-Induced Instability of the Interface between Joined Conductive Materials2022
• Modeling the kinetics of lattice defect adsorption into the interface of joint materials2011
• Nano- and micrometer-scale thin-film-interconnection failure theory and simulation and metallization lifetime prediction, Part 1: A general theory of vacancy transport, mechanical-stress generation, and void nucleation under electromigration in relation to multilevel-metallization degeneration and failure2009
• Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits2001